SAN JOSE, CA (JULY 14, 1999) | Texas Instruments Interconnection Business is showcasing new additions to its popular line of
burn–in test sockets for the full range of semiconductor products at SEMICON West ’99. TI Interconnection Business is a global
leader in the critical back–end process for burn–in test, providing manufacturers of ASIC, logic, memory chips and microprocessors
a proven method for ensuring their products are fully tested and burned–in before they are integrated in a host of electronic products.
At SEMICON West, TI will feature burn–in test sockets that serve manufacturers of cell phones, video games, digital cameras
and the red–hot sub–$1000 PC market.
New for SEMICON, TI is showcasing its newly expanded line of burn–in test sockets for the Rambus® DRAM market. Currently,
eight of the world’s top–10 semiconductor companies license Rambus technology and seven of the world’s top PC makers have
shipped systems using the technology. TI leads the market with sockets that accommodate smaller RDRAM devices (down to
0.75mm), a greater range of input/output pins (54, 62, 74 I/O), and a wider variety of high volume RDRAM devices, including
64, 72, 128, 144, 256, and 288–megabit devices.
Also at SEMICON, TI is introducing a new custom–built burn–in test solution for Pin Grid Array. The PGA is ideally suited for
the fast growing sub–$1,000 PC market because it optimizes the amount of technology and processing power on each
microprocessor. This makes it less costly to produce and better suited to the growing market for low–end personal computers.
The new PGA and Rambus DRAM burn–in test sockets use TI’s patented open top, auto–load/unload, zero–insertion force
design and feature a changeable adapter to accommodate a variety of package sizes.
The new sockets add to TI’s solutions for the full range of package designs, which include CSP, BGA, KGD, QFP, SOJ, SOP,
TSOP and LGA.
TI is also giving a presentation at SEMICON’s 2nd Annual Semiconductor Packaging Technologies Symposium. At his
presentation titled, "Burn–in Test for Memory Chip Scale Packages," Dr. James Forster will describe the process
used to develop a new socket, from the definition of the requirements, through prototyping, to initial production. Socket design
challenges will also be discussed along with what must happen for the industry to move to the next smallest package size, 0.5mm.
Dr. Forster’s presentation will take place during the Chip Scale Packaging Assembly Session scheduled from 9am to 12pm
on July 13 at the San Jose Hilton & Towers.
For more information or to schedule a briefing, contact Lynda Armstrong at Texas Instruments Interconnection Business at (508)
236-5388 or stop by the TI Interconnection Business booth #16104, San Jose Convention Center, The Tent.
ABOUT TEXAS INSTRUMENTS
Texas Instruments, Inc., is a global semiconductor company and the world’s leading designer and supplier of digital
signal processing solutions, the engines driving the digitization of electronics. Headquartered in Dallas, Texas, the company’s
major businesses also include Calculators, Productivity Products, Sensors & Controls, and Digital Light Products
technologies. The company has manufacturing and/or sales operations in more than 25 countries.
TI is traded on the New York Stock Exchange under the symbol TXN. More information is located on the World Wide Web
at www.ti.com.
ABOUT TI INTERCONNECTION
Located in Mansfield, Mass., the Interconnection Business is part of TI’s Materials & Controls group.
Note to Editors: Rambus and RDRAM are registered trademarks of Rambus Inc. Direct Rambus and Direct RDRAM are trademarks of Rambus Inc.
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