SAN JOSE, CA (JULY 14, 1999) | Texas Instruments Interconnection Business is delivering a major piece of the manufacturing
puzzle for the sub–$1,000 PC market with the introduction of its first custom–built burn–in test socket for Pin Grid Array (PGA).
PGA has become a popular semiconductor package because it optimizes the amount of technology and processing power on
each microprocessor, making it less costly to produce and better suited to the growing market for low–end personal computers.
The new socket uses TI’s patented open top, auto–load/unload, zero–insertion force design and features a changeable
adapter to accommodate a variety of package sizes. The new PGA socket adds to TI’s solutions for the full range of package
designs, which include CSP, BGA, KGD, QFP, SOJ, SOP, TSOP and LGA.
"Red hot consumer demand for low–end PCs makes the PGA an excellent solution," said Keith Wheeler, microprocessor
BITS segment manager for TI Interconnection Business. "Since TI had the fundamentals in place — design, development,
rapid prototyping and, most importantly, a highly flexible and customizable socket design — we were able to build a PGA solution
in a very short time."
The new PGA socket was developed for one of the world’s largest microprocessor manufacturers. According to Wheeler, "It is
the only socket within TI’s burn–in test product family to feature dual movable pinch contacts. This increases reliability during interface
with the package’s pins and extends the overall life of the socket."
The new PGA socket meets the strict specifications of today’s semiconductor manufacturers:
SOCKET FEATURES
Temperature rating |
125° Celsius |
Cover actuation force:
With heat sink
Without heat sink |
16 lbs. max.
12 lbs. max.
|
Retention force |
10 lbs. minimum |
Insertion cycle rating |
10,000 cycles |
Heat sinks |
Available |
TI’s patented burn–in test socket design minimizes pin damage and improves overall yield by
employing a "pinch" or dual beam style contact that interfaces with the sides of
each individual pin in the densely arranged pin grid array.
"The trend in IC packaging is to move from pins to solder balls, such as the ball grid
array and the newer micro BGA, because they minimize lead pitch and are better suited for the
smaller, newer products such as laptop computers and cell phones," Wheeler said.
"However, PGA is a proven technology that uses the current manufacturing infrastructure
and delivers the right performance at the right price for low–end PCs and similar products."
ABOUT TEXAS INSTRUMENTS
Texas Instruments, Inc., is a global semiconductor company and the world’s leading designer and supplier of digital
signal processing solutions, the engines driving the digitization of electronics. Headquartered in Dallas, Texas, the company’s
major businesses also include Calculators, Productivity Products, Sensors & Controls, and Digital Light Products
technologies. The company has manufacturing and/or sales operations in more than 25 countries.
TI is traded on the New York Stock Exchange under the symbol TXN. More information is located on the World Wide Web
at www.ti.com.
ABOUT TI INTERCONNECTION
Located in Mansfield, Mass., the Interconnection Business is part of TI’s Materials & Controls group.
Note to Editors: Rambus and RDRAM are registered trademarks of Rambus Inc. Direct Rambus and Direct RDRAM are trademarks of Rambus Inc.
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