TI to showcase leading CSP solutions at Chip Scale International ’99
MANSFIELD, MA (SEPTEMBER 14, 1999) | Texas Instruments Interconnection Business is fueling the red–hot growth
for chipscale packages by equipping manufacturers with a critical component for ensuring reliability — the burn–in
test socket. TI will showcase its leading family of burn–in solutions for chipscale packages at Chip Scale International
’99, Sept. 14–15, at the San Jose Convention Center.
Introduced just a few years ago, the chipscale package has been widely adopted because it allows designers to reduce
the form factor for packaging their silicon. As a result, consumer products requiring miniaturization such as cell phones,
digital cameras, and computers can pack more functionality and computing power into a smaller space.
According to industry estimates, CSPs will skyrocket from 400 million units in 1998 to 3.5 billion units in 2001, fueled
by a growing worldwide demand for smaller, more powerful electronic products. Digital cameras, for instance, are
expected to increase from 1.3 million units in 1998 to 5 million units in 2002. Hand–held computers should increase
to 5.7 million units this year, up more than 45% over 1998.
Burn–in test sockets enable semiconductor manufacturers to test CSPs to ensure the reliability of the devices before
they are integrated and shipped in a wide range of products. TI was an early provider of burn–in solutions for chipscale
packages and delivers one of the broadest lines of burn–in test sockets for chipscale packages, including recently–introduced
sockets for testing Rambus® DRAM. TI supports the full range of package designs, including BGA, QFP, SOJ, SOP, TSOP
and LGA.
For more information or to schedule a briefing, contact Lynda Armstrong at Texas Instruments Interconnection Business
at (508) 236-5388 or stop by the TI Interconnection Business booth #1826 in Hall 3 at the San Jose Convention Center.
ABOUT TEXAS INSTRUMENTS
Texas Instruments, Inc., is a global semiconductor company and the world’s leading designer and supplier of digital
signal processing solutions, the engines driving the digitization of electronics. Headquartered in Dallas, Texas, the company’s
major businesses also include Calculators, Productivity Products, Sensors & Controls, and Digital Light Products
technologies. The company has manufacturing and/or sales operations in more than 25 countries.
TI is traded on the New York Stock Exchange under the symbol TXN. More information is located on the World Wide Web
at www.ti.com.
ABOUT TI INTERCONNECTION
Located in Mansfield, Mass., the Interconnection Business is part of TI’s Materials & Controls group.
Note to Editors: Rambus and RDRAM are registered trademarks of Rambus Inc. Direct Rambus and Direct RDRAM are trademarks of Rambus Inc.
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