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Site Updated October 16, 2016

* * * Sensata > Products > Burn-in Sockets > BGA >

Burn-in Test Socket: 1.27 mm Pitch BGA (Ball Grid Array)


Mechanical Characteristics
Contact system
Normally closed
Package insertion force
ZIF
Contact force
Typical: Approximately 12g/pin
Range: 10–15g/pin
Durability
Minimum: 10,000 cycles
Temperature range
-40°C to 150°C
Contact point
Side of solder ball
Maximum IC offset
During load: ±0.5 mm in X or Y axis
Actuation force
Typical: 3.0–5.0kg

Electrical Characteristics
Current rating
1 amp per pin
Insulation resistance
1000 mohms at 500V DC
Dielectric voltage
Withstands 700V AC for 1 minute
Contact resistance at 10mA Initial: 50 mohm maximum initial
After 10K cycles: 1 ohm maximum
Inductance
6nH at 50 MHz, approximately

Product Accommodations
I/O
Maximum: 32x32 array
IC size
Maximum: 42.5x42.5mm
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BGA IC Test and Burn-In Sockets

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