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0.3 mm pitch CSP in development!

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Tel: 1-508-236-1868

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burninsockets@sensata.com

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Site Updated October 16, 2016

* * * Sensata > Products > Burn-in Sockets > BGA > CSP >

0.80 mm Pitch CSP Burn-in Test Sockets


Mechanical Characteristics
Contact system
Normally closed
Package insertion force
ZIF
Contact force
Typical: Approximately 12g/pin
Range: 10–15g/pin
Durability
Minimum: 10,000 cycles
Temperature range
-40°C to 150°C
Contact point
Side of solder ball
Maximum IC offset
During load: ±0.5 mm in X or Y axis
Actuation force
Typical: 3.0kg (300–pin)
Thru–hole contact
Length: 2.0mm

Electrical Characteristics
Current rating
1 amp per pin
Insulation resistance
1000 mohms at 500V DC
Dielectric voltage
Withstands 700V AC for 1 minute
Contact resistance at 10mA
Initial: 50 mohm maximum initial
After 10K cycles: 1 ohm maximum
Inductance
6nH at 50 MHz, approximately

Product Availability
Maximum package sizes and socket dimensions

Package max: 27 x 27 mm
Outline max: 41 x 41 mm

Package max: 23 x 23 mm
Outline max: 36 x 36 mm

Package max: 19 x 19 mm
Outline max: 32 x 32 mm

Package max: 13 x 13 mm
Outline max: 25 x 25 mm
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0.8mm BGA IC Test and Burn-In Sockets

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