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Product Brochures

CSP 0.5mm Pitch Brochure
0.5 mm Pitch BGA CSP (PDF)
4/26/05
720KB
2 Pages
Logic Brochure
Logic (PDF)
February, 2008
3.7MB
6 Pages
Memory Brochure
Memory (PDF)
4/26/05
2.1MB
4 Pages

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Site Updated October 16, 2016

* * * Sensata > Products > Burn-in Sockets >

IC Burn-in Test Socket Product Overview
Solutions for the Industry’s Most Demanding CSP Requirements


Whether you are looking from our existing portfolio of burn-in test sockets or a custom CSP solution, Sensata offers unmatched capacity, worldwide bandwidth and manufacturing flexibility. Our global workforce is ready to partner with you to find the best solution, no matter what you need.


I/O Chart

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24/7 Worldwide Support
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CSP Leaders
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Interconnect Since 1970
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Request more info.

Contact a product specialist.


0.3 mm pitch CSP in development!

Call now. Let us capture your 0.3 mm-pitch input!

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Tel: 1-508-236-1868

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burninsockets@sensata.com

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sensata.com/burninsockets

BGA Series IC Burn-In Test Sockets
Ball Grid Array Packages
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LGA IC Burn-In Test Sockets
Land Grid Array Packages
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QFP IC Burn-In Test Sockets
Quad Flat Pack Packages
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The future is clear... More I/O at smaller sizes.
Our team creates next generation sockets so that we have the best solution, at the right time, to meet your semiconductor socket needs.
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