Sensata | Products: BGA Memory Sockets

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Sensata > Products > Controls > Burn–In Sockets > BGA >

BGA Memory Sockets

Extensive Line of Memory Socket Offerings

•		Open top, auto–actuated socket
•		Small socket outline — Maximizes burn–in board density and process throughput
•		Multiple package outlines and heights — See table at bottom
•		Custom options — Adapterless, coverless plus different lead lengths, plating, and color options available
•		Proven contact
•		Removable adapter

Design features of the BGA memory socket by Sensata Technologies

Mechanical Characteristics
Contact system	Varies based on Pb or Pb–free solder balls (10–20gms per pin)
Package insertion force	ZIF
Temperature range	-55°C to 150°C
Actuation force	Typical: 1–3.5kg

Electrical Characteristics
Current rating	0.25–0.50 amp per pin @ 125°C
Insulation resistance	1000 mohms at 500VDC
Dielectric voltage	Withstands 500VDC for 1 minute
Contact resistance at 10mA	Initial: 150 mOhm maximum After 10K cycles: 1 Ohm maximum
Inductance	6nH at 50 MHz, approximately

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Socket attributes of the BGA memory socket by Sensata Technologies

BGA Memory Socket Platforms (Series)

Pitch

Minimum Outline

Maximum Outline

Platform

1.27mm

19.5x24x17

33.2x28.4

CBGxxx-049

CBGxxx-059

1.00mm

27.5x32.5x17

46.2x46.2x18.4

CBGxxx-052
CBGxxx-069
CBGxxx-087

CBGxxx-A109
CLGxxx-012

FBGAxxx-027
FBGAxxx-030

0.80mm

22x18x15.9

35x35x23

CBGxxx-051
CBGxxx-056
CBGxxx-057
CBGxxx-063
CBGxxx-073
CBGxxx-077
CBGxxx-095
CBGxxx-103
CBGxxx-A70

CBGxxx-A98
CBGxxx-A99
CBGxxx-A100
FBGAxxx-003
FBGAxxx-012
FBGAxxx-014
FBGAxxx-022
FBGAxxx-023

FBGAxxx-025
FBGAxxx-037
FBGAxxx-040
FBGAxxx-044
FBGAxxx-A104
FBGAxxx-A105
FBGAxxx-A110
FBGAxxx-A118

0.75mm

19x18x15.4

30x26.5x17.3

CBGxxx-020
CBGxxx-035
CBGxxx-042

CLGxxx-050
CBGxxx-A111

FBGAxxx-021
FBGAxxx-041

0.65mm

19x19x15.8

28x26x19

CBGxxx-079

CBGxxx-101

0.50mm

26x19.5x18.1

40x40x19.6

CBGxxx-086
CBGxxx-A85

CBGxxx-A87
CBGxxx-A94

CBGxxx-A120

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