Sensata | Products: BGA Series of IC Test and Burn-In Sockets by Sensata Technologies

Contacts & Distributors

Brazil/Brasil

Simplified Chinese

Traditional Chinese

Europe

Japan

Search Sensata:

Burn–In Sockets
•	Products:
	–	BGA: 0.4mm / 0.5mm Pitch CSP 0.65mm Pitch CSP 0.75mm Pitch CSP 0.80mm Pitch CSP 1.0mm Pitch 1.27mm Pitch Memory Sockets
	–	LGA
	–	QFP
	–	Others
•	Engineering
	–	Contact Technology: Buckling Beam Pinch Style
	–	Platform Design
•	Contact Us
•	Make an Online Request
•	Terms & Conditions

Looking for a specific socket? Click here.

Sensata > Products > Controls > Burn–In Sockets >

Ball Grid Array (BGA) Burn–in Test and Memory Sockets

Many Pitch Sizes Available

All, By Pitch Size

0.50mm pitch
0.65mm pitch
0.75mm pitch
0.80mm pitch
1.00mm pitch
1.27mm pitch

CSP Only, By Pitch Size

Chip scale packages:
0.50mm pitch
0.65mm pitch
0.75mm pitch
0.80mm pitch

BGA Memory Sockets

24/7 Worldwide Support

CSP Technology Leadership

Product Brochures

	0.5mm Pitch BGA CSP (PDF) 4/26/05 720KB 2 Pages
	Logic (PDF) 4/26/05 3.3MB 6 Pages
	Memory (PDF) 4/26/05 2.1MB 4 Pages

The World Depends on Sensors and Controls

©2008 Sensata Technologies, Inc.
All rights reserved.

Policies, Legal, Terms of Use

Employee my.Sensata