Sensata | Products: IC Burn-In Test Sockets by Sensata Technologies

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Product Brochures

	0.5mm Pitch BGA CSP (PDF) 4/26/05 720KB 2 Pages
	Logic (PDF) 4/26/05 3.3MB 6 Pages
	Memory (PDF) 4/26/05 2.1MB 4 Pages

Site Updated August 25, 2008

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IC Burn–in Test Socket Products

Solutions for the Industry’s Most Demanding CSP Requirements

Whether you are looking from our existing portfolio of burn–in test sockets or a custom CSP solution, Sensata offers unmatched capacity, worldwide bandwidth and manufacturing flexibility. Our global workforce is ready to assist you in finding the right solution and will deliver to meet your diverse needs.

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CSP Technology Leadership

The future is clear... More I/O at smaller sizes.
Our team continues to work on the next generation sockets so that we have the right solution, at the right time, to meet your socket needs.

BGA

Ball Grid Array Packages

LGA

Land Grid Array Packages

QFP

Quad Flat Pack Packages

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