Off–set contact = 0.8 to 1.27 mm pitch
In–line contact = 0.5 mm pitch or less
Sensata also offers a small 26x19.50 mm outline through–hole socket for smaller 0.50 mm packages. This socket can accept packages up to 11x17 mm and utilizes a dual pinch style contact, eliminating any witness marks on the bottom of the ball.
Above: (Left) Off–set contact used for BGA pitches of 0.8–1.27mm. (Middle) In–line contact used for BGA pitches 0.5–1.0mm. (Right) Dual pinch contact, Sensata internal SEM photograph showing minimal ball damage.
Package insertion force
Typical: Approximately 15g/pin Range: 10–20g/pin
Minimum: 10,000 cycles
-55°C to 150°C
Side of solder ball
Maximum IC offset
During load: ±1.0 mm in X or Y axis
1 amp per pin
1000 mohms at 500V DC
Withstands 700V AC for 1 minute
Contact resistance at 10mA
Initial: 50 mohm maximum After 10K cycles: 1 ohm maximum