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0.3 mm pitch CSP in development!

Call now. Let us capture your 0.3 mm-pitch input!

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Tel: 1-508-236-1868

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burninsockets@sensata.com

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sensata.com/burninsockets


Site Updated October 16, 2016

* * * Sensata > Support > Burn-in Test Sockets >

IC Burn-In Test Socket Platform Design
It’s About Flexibility, Flexibility and, Oh Yeah, Flexibility


Sensata Interconnection burn-in sockets are designed with “flexibility of design” in mind. This allows easier modification for different package sizes. A platform design approach is utilized where a base socket can accommodate a variety of different package sizes. The adapter, which personalizes the socket for a specific customer’s package, is designed as a separate part.


Platform benefits include:

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Fast and low cost method. Changing the adapter provides a fast, low cost method of supplying new sockets for each new package size without the expense and time of tooling an entire socket.
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Maximize board capacity and through–put. The availability of different bases within a socket family allows the Interconnection team to work with our customers to select the smallest footprint, maximizing burn-in board capacity and oven through–put.
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Proven contact technology.The socket uses the same proven, qualified contact technology—improving reliability and confidence in the performance of the socket.


To learn more, please contact us »

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Product Brochures

CSP 0.5mm Pitch Brochure  Logic Brochure  Memory Brochure
0.5 mm Pitch BGA CSP (PDF)
4/26/05, 720KB, 2 Pages
Logic (PDF)
4/26/05, 3.3MB, 6 Pages
Memory (PDF)
4/26/05, 2.1MB, 4 Pages
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24/7 Worldwide Support
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CSP Leaders
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Interconnect Since 1970
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Adapter


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