Bring your next-generation designs to market, faster than ever.
Our hands-on, engineer-to-engineer design process and round-the-clock global support empower real-time decision making and 24/7 development. You’ll also benefit from our:
- World leadership in Fine Pitch, high temperature and Active Thermal solutions
- Unequaled portfolio of interconnection solutions, offering more I/O choices, smaller form factors and superior performance
- 50 years of experience serving the semiconductor industry
- Unmatched manufacturing flexibility and worldwide capabilities— including emerging chip scale packaging (CSP) design and assembly techniques
Put it all together, and you get the solutions and support you need to achieve disruptive innovations and superior speed to market.