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Features

  • Accepts wide range of PGA packages from 8 X 8 through 15 X 15
  • Carrier can be molded from Electro-Static-Dissipative (ESD) materials
  • Designed to be used with automatic test handlers
  • For other PGA requirements consult factory
  • Molded for high temperature materials for applications up to 150°C
  • For additional stand-off configurations consult

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