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Features

  • Open top, zero insertion force design for automatic loading
  • Compact size for high board density
  • Highly reliable, pre-loaded contacts
  • Accommodate pitch sizes 0.50, 0.635, 0.65, and 0.80mm
  • Optional thermal pin for package Heat Sink (consult factory)
  • Thru hole design
  • High force contact version (H) available for Pb free packages (single beam type)

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Specifications

Socket Body

PES, PEI, LCP or Equivalent

Contact

Beryllium Copper Alloy

Contact Plating

Gold over Nickel

Contact Normal Force

35-45 grams

Contact Resistance

50 mΩ

Dielectric

600V AC for 1 minute

Temperature Rating

150°C

Insulation Resistance

5,000 MWΩ @ 500V DC

Durability

10,000 cycles min.

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