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Features

  • Compact size for maximum board density
  • Wide target area for easy entry and removal of IC leads
  • Dual face-wipe contacts for long, dependable life
  • Excellent component clearance under the socket
  • Four high corner standoffs for easy inspection and cleaning of the PC board
  • For temperatures up to 150°C; for higher temperature applications consult the factory

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Specifications

Specifications
Socket Body PEI or Equivalent
Contact Beryllium Copper Alloy
Contact Plating Gold over Nickel
Contact Normal Force 35~45 grams
Contact Resistance 50 mΩ max
Dielectric 300V AC for 1 Minute
Temperature Rating 150°C
Dielectric 5,000 MΩ @ 500V DC
Durability 10,000 cycles min.
Thermal Pin Power Dissipation 2W Minute

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