Stock Distributors

Need more information?

Contact us to request pricing, availability and customization options

Contact Us

Features

  • Compact size for maximum board density
  • Wide target area for easy entry and removal of IC leads
  • Dual face-wipe contacts for long, dependable life
  • Excellent component clearance under the socket
  • Four high corner standoffs for easy inspection and cleaning of the PC board
  • For temperatures up to 150°C; for higher temperature applications consult the factory

Downloads

Specifications

Specifications
Socket Body PEI or Equivalent
Contact Beryllium Copper Alloy
Contact Plating Gold over Nickel
Contact Normal Force 35~45 grams
Contact Resistance 50 mΩ max
Dielectric 300V AC for 1 Minute
Temperature Rating 150°C
Dielectric 5,000 MΩ @ 500V DC
Durability 10,000 cycles min.
Thermal Pin Power Dissipation 2W Minute

Related Products

View All Products
Image of 656 series product

656 Series SSOP Devices ZIF

Semiconductor Interconnect
View Product
datasheet Get a Quote
Image of 613 series product

613 Series Dual In-line Packages (DIP)

Semiconductor Interconnect
View Product
datasheet Get a Quote
Image of 625 series product

625 Series Quad Pack Contactor for 2”x2” Carrier

Semiconductor Interconnect
View Product
datasheet Get a Quote
Image of 626 series product

626 Series FlatPack Contactor for 2”x2” Carrier

Semiconductor Interconnect
View Product
datasheet Get a Quote
Image of 629 series product

629 Series Quad Pack Contactor for 1 ¼”x 1 ¼” Carrier

Semiconductor Interconnect
View Product
datasheet Get a Quote
Image of 676 series product

676 Series TSSOP Devices  Dual Pinch ZIF

Semiconductor Interconnect
View Product
datasheet Get a Quote
Image of 680 series product

680 Series QFP Devices Dual Pinch

Semiconductor Interconnect
View Product
datasheet Get a Quote

Related Resources

Brochures

Interconnection Business Burn In Solutions

View More
Brochures

Memory Burn in Sockets - Brochure

View More