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Contact UsFeatures
- Handles package sizes 3x3mm to 10x10mm
- Clam shell
- Compression Surface Mount
- Elastomer interface material
- Wedge guided pressure pad for direct Z axis pressure on the package during lid engagement
- HTOL Compatible
- Modular Design: Minimal components
- Adaptable to various package thickness
- Any pitch or pitch combination 0.4mm and greater
- Max I/0 = 250
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Specifications
| Extremely High Frequency | > 20GHz |
| Self Inductance | 0.15nH |
| Mutual Inductance | 0.04nH |
| Mutual Capacitance | 0.013pF |
| Contact Resistance | < 50 mW |
| Current Rating | 0.5 amps per I/O |
| Contact Force | 18 grams |
| Extremely Coplanar | < 0.001" |
| Environmental Capability | - 40°C to 150°C |
| Typical Cycle Life | 10,000 cycles min. |
