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Features

  • 0.4mm pitch for large array
  • Compression surface mount
  • Support up to 34x34 ball matrix
  • Z-axis compliant buckling beam, contact provides stable contact performance independent or solder ball height and composition
  • Sharpe edge of dual-point contact tip provides high electrical performance, minimizing ball damage
  • Staggered fan out footprint for PCB design consideration
  • Advanced latching system provide the ability to handle very thin package, limiting package wrap

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Specifications

Body Materials PES, PEI, LCP, or Equivalent
Contact Material Beryllium Copper Alloy
Contact Plating Gold
Contact Normal Force 13 gram average
Contact Resistance 200~300 mΩ
Capacitance  
Temperature Rating 150°C
Durability 10,000 cycles min.

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