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Features

  • 0.4mm pitch
  • Compression surface mount
  • High performance/low cost achieved through use of carrier loaded stamped contact
  • Z-axis compliant buckle beam contact supports any type of solder ball

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Specifications

Body Materials PES, PEI, LCP or Equivalent
Contact Material Beryllium Copper Alloy
Contact Plating Gold
Contact Force 13 gram average
Contact Resistance 200-300 mΩ
Temperature Rating 150°C
Durability 10,000 cycles min.

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