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Contact UsFeatures
- 0.5mm and 0.8mm pitch
- Compression surface mount
- High performance/low cost achieved through use of carrier loaded stamped contact
- Z-axis compliant buckling beam contact supports any type solder ball shape and composition
- Compact outline and low actuation force achieved through use of innovative latching mechanism
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Specifications
| Body Materials | PEI, PES, LCP, or Equivalent |
| Contact Material | Beryllium Copper Alloy |
| Contact Plating | Gold |
| Contact Force | 13 gram average |
| Contact Resistance | 200~300 mΩ typical |
| Temperature Rating | Burn-in 150°C |
| Durability | 10,000 cycles min. |
