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Features

  • 0.5mm and 0.8mm pitch
  • Compression surface mount
  • High performance/low cost achieved through use of carrier loaded stamped contact
  • Z-axis compliant buckling beam contact supports any type solder ball shape and composition
  • Compact outline and low actuation force achieved through use of innovative latching mechanism

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Specifications

Specifications
Body Materials PEI, PES, LCP, or Equivalent
Contact Material Beryllium Copper Alloy
Contact Plating Gold
Contact Force 13 gram average
Contact Resistance 200~300 mΩ typical
Temperature Rating Burn-in 150°C
Durability 10,000 cycles min.

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