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Features

  • 0.8mm Pitch
  • Compression surface mount
  • Z-axis compliant "U" shaped contact supports a wide variety of solder ball shape and composition
  • Compact outline and low actuation force achieved through use of innovative latching mechanism
  • Field exchangeable IC guide

Specifications

Body Materials

PES, PEI, LCP, or Equivalent

Contact Material

Beryllium Copper Alloy

Contact Plating

Gold

Contact Force

13 Gram Average

Contact Resistance

200~300 mΩ

Temperature Rating

150°C

Durability

10,000 cycles min.

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