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Contact UsFeatures
- 0.8mm Pitch
- Compression surface mount
- Z-axis compliant "U" shaped contact supports a wide variety of solder ball shape and composition
- Compact outline and low actuation force achieved through use of innovative latching mechanism
- Field exchangeable IC guide
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Specifications
|
Body Materials |
PES, PEI, LCP, or Equivalent |
|
Contact Material |
Beryllium Copper Alloy |
|
Contact Plating |
Gold |
|
Contact Force |
13 Gram Average |
|
Contact Resistance |
200~300 mΩ |
|
Temperature Rating |
150°C |
|
Durability |
10,000 cycles min. |
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