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Features

  • 0.4mm, 0.5mm, 0.65mm, and 8mm pitch
  • Low cost design using stamped cantilever contact
  • Staggered, through hole tail design for BIB design consideration
  • ACTIVE ALIGNMENT: Active IC guide feature improving on package alignment accuracy
  • Optimal thermal contact for package e-pad
  • Solutions for Power Devices (Consult your Sales Rep)
    • Multiple ePad Pin
    • Thermal Buttons/Slugs

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Specifications

Body Materials PES or Equivalent
Contact Material Beryllium Copper Alloy
Contact Plating Gold
Contact Force 20~25 grams for leaded and lead-free devices
Contact Resistance <200mΩ
Temperature Rating 150°C
Durability 10,000 cycles min.

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